
Business Areas


Key Area
Dicing
Korea’s only ultra-precision processing semiconductor processing spindles

Key Area
Grinding
Implementing surface light levels of less than 0.2 micrometers, fast rotating grinding units

Key Area
Milling
High-strength and high-power material processing realization

Key Area
Drilling
Maintaining constant torque and stiffness when rotating spindles at high speeds

Key Area
Fixing
Vacuum adsorption, wafer retention, and localization

Key Area
Transporting
Ultra-precision transfers, air bearing cylinders