
Business Areas


KEY Business
Dicing
Korea’s only ultra-precision processing semiconductor processing spindle

KEY Business
Grinding
Implementing surface light levels of less than 0.2 micrometers, fast rotating grinding units

KEY Business
Milling
High-strength & High-power High-Strength Material Processing Realization

KEY Business
Drilling
Maintain constant torque and stiffness when rotating spindle at high speed

KEY Business
Fixing
Vacuum adsorption, wafer retention, and localization

KEY Business
Transporting
ultra-precision transfer, air bearing cylinder