Business Areas
KEY Business
Dicing
Korea’s only ultra-precision processing semiconductor processing spindle
KEY Business
Grinding
Implementing surface light levels of less than 0.2 micrometers, fast rotating grinding units
KEY Business
Milling
High-strength & High-power High-Strength Material Processing Realization
KEY Business
Drilling
Maintain constant torque and stiffness when rotating spindle at high speed
KEY Business
Fixing
Vacuum adsorption, wafer retention, and localization
KEY Business
Transporting
ultra-precision transfer, air bearing cylinder