Business Areas
Key Area
Dicing
Korea’s only ultra-precision processing semiconductor processing spindles
Key Area
Grinding
Implementing surface light levels of less than 0.2 micrometers, fast rotating grinding units
Key Area
Milling
High-strength and high-power material processing realization
Key Area
Drilling
Maintaining constant torque and stiffness when rotating spindles at high speeds
Key Area
Fixing
Vacuum adsorption, wafer retention, and localization
Key Area
Transporting
Ultra-precision transfers, air bearing cylinders